Use copper foil as carrier, coated with graphene and heat resistant adhesive, excellent heat conducting.
Ultra-thin design for electronic components and parts.
EMI shielding, good resistance to heat, ageing and humidity.
Tape Thickness (mm)
Release Liner Thickness (mm)
Thermal management solution for electronic components and parts.
EMI shielding for electronic products
Thermal Conductivity (W/m.K)
Surface Resistivity (Ω/□)
6 months after received. When in storage, avoid direct sunlight, high temperature (over 40°C) and high humidity (over 70% RH).