Ultra-thin copper foil coated with acrylic adhesive.
Use copper foil as carrier, good thermal conductivity.
Excellent resistance to weather, cold, heat and water.
Release Liner Thickness (mm)
Bonding conductive components of electronics.
JIS Z 0237 8
JIS Z 0237 11
Release Force (gf/25mm)
50mm wide sample peel at 500 mm/min
Thermal Conductivity (W/m.K)
thermal conductivity of copper
6 months after received. When in storage, avoid direct sunlight, high temperature (over 40°C) and high humidity (over 70% RH).